- All sections
- C - Chemistry; metallurgy
- C09J - Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives
- C09J 9/02 - Electrically-conducting adhesives
Patent holdings for IPC class C09J 9/02
Total number of patents in this class: 1417
10-year publication summary
118
|
112
|
108
|
130
|
127
|
126
|
106
|
100
|
97
|
36
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Dexerials Corporation | 1826 |
173 |
Hitachi Chemical Company, Ltd. | 2455 |
99 |
Nitto Denko Corporation | 7879 |
56 |
Sekisui Chemical Co., Ltd. | 3159 |
53 |
3m Innovative Properties Company | 18406 |
51 |
Henkel AG & Co. KGaA | 10129 |
42 |
Tatsuta Electric Wire & Cable Co., Ltd. | 368 |
41 |
Sony Chemical & Information Device Corporation | 268 |
37 |
Resonac Corporation | 2233 |
36 |
Showa Denko Materials Co., Ltd. | 629 |
24 |
The Furukawa Electric Co., Ltd. | 3486 |
22 |
Lintec Corporation | 1915 |
21 |
Namics Corporation | 393 |
16 |
Tanaka Kikinzoku Kogyo K.K. | 589 |
15 |
Boe Technology Group Co., Ltd. | 35384 |
14 |
Sumitomo Bakelite Co., Ltd. | 1416 |
14 |
Kukdo Advanced Materials Co., Ltd. | 41 |
14 |
Immunolight, LLC | 199 |
13 |
Shin-Etsu Chemical Co., Ltd. | 5132 |
12 |
Three Bond Co., Ltd. | 209 |
12 |
Other owners | 652 |